Our research lab focuses on the development of various soft electronic devices based on multi-dimensional nanomaterials and functional polymers that allow for versatile shape transformations. Central to our efforts are semiconductor packages, solar cells, displays, supercapacitors, tactile sensors, motion detection sensors, and light sensors that possess properties of stretchability and self-healing. We aim to advance Human-Machine-Interface research to facilitate the integration of humans and machines.

​

Recently, we have been concentrating on the development of advanced semiconductor packaging technologies and smart devices based on artificial intelligence (AI). AI technology imbues the devices we have been developing with intelligence, aligning with the latest global research trends. Additionally, we intend to develop cutting-edge soft packaging technologies by integrating the latest flexible electronic device technologies with semiconductor packaging. Most recent research topic in packaging area is development of thermally conductive composite materials for true 3D system in package and heterogeneous integration technologies.