Publications | SDPL (성균관대학교 김종웅)

Peer Reviewed Articles (SCIE-indexed)

2024

177. Su Bin Choi, Taejoon Noh, Seung-Boo Jung,* Jong-Woong Kim*, Stretchable Piezoresistive Pressure Sensor Array with Exceptional Sensitivity, Strain-Insensitivity, and Reproducibility, Advanced Functional Materials, Under major revision, corresponding author (IF: 19).

176. Tran Duc Khanh, Sushmitha Veeralingam, Jong-Woong Kim*, Self-Repairing Thermoplastic Polyurethane-Based Triboelectric Nanogenerator with Molybdenum Disulfide Charge-Trapping for Advanced Wearable Devices, Nano Energy, Under minor revision, corresponding author (IF: 17.6).

175. Su Bin Choi, Jong-Woong Kim*, Dual-Responsive Fully Self-Healing Triboelectric Pressure Sensor: Integrating Truncated Sphere Morphology with Deep Learning-Enhanced Signal, Nano Energy, Under minor revision, corresponding author (IF: 17.6).

174. Seung-Han Kang†, Jeong-Wan†, Jong Min Lee, Sanghee Moon, Seung Bum Shin, Su Bin Choi, Donghwan Byeon, Jaehyun Kim, Myung-Gil Kim, Yong-Hoon Kim*, Jong-Woong Kim*, Sung Kyu Park*, Full Integration of Highly Stretchable Inorganic Transistors and Circuits within Molecular-Tailored Elastic Substrates on a Large Scale, Nature Communications, 15, 2814, 2024, corresponding author (IF: 16.6).

173. Jun Sang Choi, Jagan Singh Meena, Su Bin Choi, Seung-Boo Jung,* Jong-Woong Kim*, Water-triggered self-healing of Ti3C2Tx MXene standalone electrodes: Systematic examination of factors affecting the healing process, Small, Early View, https://doi.org/10.1002/smll.202306434, corresponding author (IF: 13.3).

2023

172. Su Bin Choi, Jagan Singh Meena, Jinho Joo*, Jong-Woong Kim*, Autonomous Self-Healing Wearable Flexible Heaters Enabled by Innovative MXene/Polycaprolactone Composite Fibrous Networks and Silver Nanowires, Advanced Composites & Hybrid Materials, 6, 227, 2023, corresponding author (IF: 20.1).

171. Hyun Sik Shin, Su Bin Choi, Jong-Woong Kim*, Harnessing Highly Efficient Triboelectric Sensors and Machine Learning for Self-Powered Intelligent Security Applications, Materials Today Advances, 20, 100426, 2023, corresponding author (IF: 10.0).

170. Su Bin Choi, Hyun Sik Shin, Jong-Woong Kim*, Convolution Neural Networks for Motion Detection with Electrospun Reversibly-Crosslinkable Polymers and Encapsulated Ag Nanowires, ACS Applied Materials & Interfaces, 15, 47591, 2023, corresponding author (IF: 9.5).

169. Tran Duc Khanh, Jagan Singh Meena, Su Bin Choi, Jong-Woong Kim*, Breathable, Self-Healable, Washable and Durable All-Fibrous Triboelectric Nanogenerator for Wearable Electronics, Materials Today Advances, 20, 100427, 2023, corresponding author (IF: 10.0).

168. Su Bin Choi, Hooseok Lee, Jinseok Lee*, Jong-Woong Kim*, Static electricity-based motion artifact-free electrocardiography with novel Ti3C2Tx MXene/Ag nanowire/polymer hybrid dry electrodes, Journal of Materials Chemistry B, 11, 8754, 2023, corresponding author (IF: 7.0).

167. Jagan Singh Meena, Tran Duc Khanh, Seung-Boo Jung*, Jong-Woong Kim*, Self-Repairing and Energy-Harvesting Triboelectric Sensor for Tracking Limb Motion and Identifying Breathing Patterns, ACS Applied Materials & Interfaces, 15, 29486, 2023, corresponding author (IF: 9.5).

166. Su Bin Choi, Jagan Singh Meena, Jong‑Woong Kim*, Revolutionizing Thermal Stability and Self‑Healing in Pressure Sensors: A Novel Approach, Advanced Fiber Materials, 5, 2028, 2023, corresponding author (IF: 16.1).

165. Jagan Singh Meena, Su Bin Choi, Seung-Boo Jung*, Jong-Woong Kim*, Advances in Silver Nanowires-Based Composite Electrodes: Materials Processing, Fabrication, and Applications, Advanced Materials Technologies, 8, 2300602, 2023, corresponding author (IF: 6.8).

164. Yongbin Lee, Hyunsik Shin, Jong-Woong Kim*, Jinseok Lee*, A Convolutional Neural Network for Classification of Stimuli based on Stretchable Mechanical Sensor, IEEE Sensors Journal, 23, 20338, 2023, corresponding author (IF: 4.3).

163. Seong-Won Kim, Chaeyoung Kang, Tae-Yang Choi, Jong-Woong Kim, and Han-Ki Kim*, Conformal Passivation of Self-Cleanable, Flexible, and Transparent Polytetrafluoroethylene Thin Films on Two-Dimensional MXene and Three-Dimensional Ag Nanowire Composite Electrodes, ACS Applied Electronic Materials, 5, 1636, 2023 (IF: 4.7).

162. Su Bin Choi, Jung-Min Oh, Jagan Singh Meena, Hanjung Kwon, Seung-Boo Jung, Jong-Woong Kim*, Role of Oxygen in the Ti3AlC2 MAX Phase in the Oxide Formation and Conductivity of Ti3C2-Based MXene Nanosheets, ACS Applied Materials & Interfaces, 15, 8393, 2023, corresponding author (IF: 9.5).

161. Jung-Min Oh, Su Bin Choi, Taeheon Kim, Jikwang Chae, Hyeonsu Lim, Jae-Won Lim, In-Seok Seo*, Jong-Woong Kim*, Calcium annealing approach to control of surface groups and formation of oxide in Ti3C2Tx MXene, Advances in Nano Research, 15, 1, corresponding author (IF: 5.7).

160. Jagan Singh Meena, Su Bin Choi, Seung-Boo Jung*, Jong-Woong Kim*, Electronic Textiles: new age of wearable technology for healthcare and fitness solutions, Materials Today Bio, 19, 100565, 2023, corresponding author (IF: 8.2).

159. Eul-Yong Shin, Su Bin Choi, Jong Ho Lee, Byungwook Yoo, Chul Jong Han, So Hyun Park, Jun Hong Noh, Jong-Woong Kim*, Hae Jung Son*, An Inverted Layer-by-Layer Process to Enable Ultrasmooth MXene–Ag Nanowire Hybrid Electrode for Organic Photovoltaics, Solar RRL, 7, 2201130, 2023, corresponding author (IF: 7.9).

158. Jagan Singh Meena, Su Bin Choi, Tran Duc Khanh, Hyun Sik Shin, Jun Sang Choi, Jinho Joo*, Jong-Woong Kim*, Highly stretchable and robust textile-based capacitive mechanical sensor for human motion detection, Applied Surface Science, 613, 155961, 2023, corresponding author (IF: 6.7).

2022

157. Sangmoon Han, Seoung-Ki Lee, Jong-Woong Kim, Sukang Bae, Sang-Hoon Bae, Kwang-Hun Choi, Jin Soo Kim, Self-powered image array composed of touch-free sensors fabricated with semiconductor nanowires, Materials Horizons, 9, 2846, 2022 (IF: 13.3).

156. Jagan Singh Meena, Su Bin Choi, Jong-Woong Kim*, Review on Ti3C2-Based MXene Nanosheets for Flexible Electrodes, Electronic Materials Letters, 18, 256, 2022, corresponding author (IF: 2.4).

155. Yoo Bin Shin, Chul Jong Han, Youngmin Kim, Jong-Woong Kim*, Ultrareproducible Capacitive Soft Pressure Sensor Using a Self-Integrated Fibrous Network of Urethane Equipped with Diels–Alder Adducts, Advanced Engineering Materials, 24, 2100903, corresponding author (IF: 3.6).

2021

154. Yoo Bin Shin, Youngmin Kim, Chang Goo Kang, Jung-Min Oh, Jong-Woong Kim*, Ultra-robust bonding between MXene nanosheets and stretchable, self-healable microfibers, Advances in Nano Research, 11, 453, 2021, corresponding author (IF: 13.052).

153. Yun Hee Ju, Chul Jong Han, Kwang-Seok Kim*, Jong-Woong Kim*, UV-curable adhesive tape-assisted patterning of metal nanowires for ultrasimple fabrication of stretchable pressure sensor, Advanced Materials Technologies, 6, 2100776, 2021, corresponding author (IF: 7.848).

152. Hyun-Su Lim, Su Bin Choi, Hanjung Kwon, Jae-Won Lim, Chul Jong Han, Jung-Min Oh, Jong-Woong Kim*, Development of a highly flexible composite electrode comprised of Ti3C2-based MXene nanosheets and Ag nanoparticles, Electronic Materials Letters,17, 513, 2021, corresponding author (IF: 3.017).

151. Hyun-Su Lim, Jung-Min Oh, Byungwook Yoo, Chul Jong Han, Jong-Woong Kim*, Self-healable, Stretchable, and Highly Luminous Electroluminescent Elastomeric Film Using a Reversibly Crosslinkable Polyurethane, Electronic Materials Letters, 17, 385, 2021, corresponding author (IF: 3.017).

150. Hyun-Su Lim, Jung-Min Oh, Jong-Woong Kim*, One-Way Continuous Deposition of Monolayer MXene Nanosheets for the Formation of Two Confronting Transparent Electrodes in Flexible Capacitive Photodetector, ACS Applied Materials & Interfaces, 13, 25400, 2021, corresponding author (IF: 9.229).

149. Sangmoon Han, Siyun Noh, Jong-Woong Kim, Cheul-Ro Lee, Seoung-Ki Lee, Jin Soo Kim*, Stretchable Inorganic GaN-Nanowire Photosensor with High Photocurrent and Photoresponsivity, ACS Applied Materials & Interfaces, 13, 22728, 2021, co-author (IF: 9.229).

148. Seok ju Lim, Jung-Min Oh, Byungwook Yoo, Chul Jong Han, Bum-Joo Lee, Min Suk Oh, Jong-Woong Kim*, Transparent and stretchable capacitive pressure sensor using selective plasmonic heating-based patterning of silver nanowires, Applied Surface Science, 561, 149989, 2021, corresponding author (IF: 6.707).

147. Kwang Wook Choi, Cheol Shin, Sungwoo Jun, Soo Jong Park, Yooji Hwang, Jin Ho Kwak, Young Wook Park, Jong-Woong Kim*, Byeong-Kwon Ju*, Solution process manufacture of a simple, multifunctional flexible sensor based on capacitance measurement, Nanotechnology, 32, 265503, 2021, corresponding author (IF: 3.874).

2020

146. Dae-Young Um, R. Nandi1, Jeong-Hun Yang, Jin-Soo Kim, Jong-Woong Kim, Ji-Hyeon Park, Cheul-Ro Lee, Direct Synthesis of MoSe2 Thin Films on SiO2/Si Using Selenization Process of Sputtered Molybdenum, Journal of Nanoelectronics and Optoelectronics, 15, 580, 2020, co-author (IF: 0.961).

145. Yun Hee Ju, Hee-Jin Lee, Chul Jong Han, Cheul-Ro Lee, Youngmin Kim, Jong-Woong Kim*, Water-responsive pressure-sensitive adhesive with reversibly changeable adhesion for fabrication of stretchable devices, Materials & Design, 195, 108995, 2020, corresponding author (IF: 7.991).

144. Sun Ok Kim, Chul Jong Han, Cheul-Ro Lee, Youngmin Kim*, Jong-Woong Kim*, Ultrafast photo-induced interconnection of metal-polymer composites for fabrication of transparent and stretchable electronic skins, ACS Applied Materials & Interfaces, 12, 39695, 2020, corresponding author (IF: 9.229).

143. Yun Hee Ju, Hee-Jin Lee, Chul Jong Han, Cheul-Ro Lee, Youngmin Kim*, Jong-Woong Kim*, Pressure sensitive adhesive with controllable adhesion for fabrication of ultrathin soft devices, ACS Applied Materials & Interfaces, 12, 40794, 2020, corresponding author (IF: 9.229).

142. Su Bin Choi, Chan-Jae Lee, Chul Jong Han, Jae-Wook Kang, Cheul-Ro Lee, Jong-Woong Kim*, Self-healable capacitive photodetectors with stretchability based on composite of ZnS:Cu particles and reversibly crosslinkable silicone elastomer, Advanced Materials Technologies, 5, 2000327, 2020, corresponding author (IF: 7.848).

141. Jun Ho Lee, Jae Sang Heo, Yoon-Jeong Kim, Jimi Eom, Hong Jun Jung, Jong-Woong Kim, Insoo Kim, Ho-Hyun Park, Hyun Sun Mo*, Yong-Hoon Kim*, and Sung Kyu Park*, A Behavior-Learned Cross-Reactive Sensor Matrix for Intelligent Skin Perception, Advanced Materials, 32, 2000969, 2020, co-author (IF: 30.849).

140. Sun Ok Kim, Chul Jong Han, Cheul-Ro Lee, and Jong-Woong Kim*, Highly transparent, stretchable, and conformable silicone-based strain/pressure-sensitive capacitor using adhesive polydimethylsiloxane, Journal of Alloys and Compounds, 841, 155773, corresponding author (IF: 5.316).

139. Sun Ok Kim, In-Seok Seo, Jin Soo Kim, Yeon-Tae Yu, Cheul-Ro Lee, and Jong-Woong Kim*, Inverted layer processing for fabrication of ultrathin touch sensor impregnating Ag nanowires below the surface of polymer with both enlarged surface coverage of conductive pathways and ultralow roughness, Electronic Materials Letters, 16, 247, 2020, corresponding author (IF: 3.017).

138. Yoo Bin Shin‡, Yun Hee Ju‡, Hee-Jin Lee, Chul Jong Han, Cheul-Ro Lee, Youngmin Kim, and Jong-Woong Kim*, Self-Integratable, Healable and Stretchable Electroluminescent Device Fabricated via Dynamic Urea Bonds Equipped in Polyurethane, ACS Applied Materials & Interfaces, 12, 10949, 2020, corresponding author (IF: 9.229).

137. Su Bin Choi, Chul Jong Han, Cheul-Ro Lee, Jong-Woong Kim*, Interfaceless Strain and Pressure‐Sensitive Stretchable Capacitor Based on Self‐Bonding and Surface Morphology Control of a Reversibly Crosslinkable Silicone Elastomer, Advanced Materials Technologies, 5, 1900757, 2020, corresponding author (IF: 7.848).

136. Sun Ok Kim, Chul Jong Han, Youngmin Kim, Kwang-Seok Kim, Dae Up Kim, Cheul-Ro Lee, and Jong-Woong Kim*, Fabrication of a bending-insensitive in-plane strain sensor from a reversible cross-linker–functionalized silicone polymer capable of solvent vapor–assisted self-healing and self-bonding, ACS Applied Materials & Interfaces, 12, 6516, 2020, corresponding author (IF: 9.229).

2019

135. Sang-Woo Kim‡, Yun Hee Ju‡, Sangmoon Han, Jin Soo Kim, Hee-Jin Lee, Chul Jong Han, Cheul-Ro Lee, Seung-Boo Jung*, Youngmin Kim*, and Jong-Woong Kim*, UV-responsive pressure sensitive adhesive for process-induced defect-free fabrication of ultrathin imperceptible mechanical sensor, Journal of Materials Chemistry A, 7, 22588, 2019, corresponding author (IF: 12.732).

134. Sungwoo Jun, Kwang Wook Choi, Kwang-Seok Kim, Dae Up Kim, Chan-Jae Lee, Chul Jong Han, Cheul-Ro Lee, Byeong-Kwon Ju*, Jong-Woong Kim*, Stretchable photodetector utilizing the change in capacitance formed in a composite film containing semiconductor particles, Composites Science and Technology, 182, 107773, 2019, corresponding author (IF: 8.528).

133. Hooseok Lee, Heewon Chung, Jong-Woong Kim, Jinseok Lee*, Motion Artifact Identification and Removal from Wearable Reflectance Photoplethysmography Using Piezoelectric Transducer, IEEE Sensors Journal, 19, 3861, 2019 (IF: 3.301).

132. Jae-Kwan Sim, Dae-Young Um, Jong-Woong Kim, Jin-Soo Kim, Kwang-Un Jeong, and Cheul-Ro Lee*, Improvement in the performance of CIGS solar cells by introducing GaN nanowires on the absorber layer, Journal of Alloys and Compounds, 779, 643, 2019 (IF: 5.316).

131. Su Bin Choi‡, Min Suk Oh‡, Chul Jong Han, Jae-Wook Kang, Cheul-Ro Lee, Jinseok Lee*, Jong-Woong Kim*, Conformable, thin and dry electrode for electrocardiography using composite of silver nanowires and polyvinyl butyral, Electronic Materials Letters, 15, 267, 2019, corresponding author (IF:3.017).

130. Sungwoo Jun‡, Su Bin Choi‡, Chul Jong Han, Yeon-Tae Yu, Cheul-Ro Lee, Byeong-Kwon Ju*, Jong-Woong Kim*, Fabrication and Characterization of a Capacitive Photodetector Comprising a ZnS:Cu Particle/Polyvinyl Butyral Composite, ACS Applied Materials & Interfaces, 11, 4416, 2019, corresponding author (IF: 9.229).

129. Sungwoo Jun‡, Sun Ok Kim‡, Hee-Jin Lee, Chul Jong Han, Chan-Jae Lee, Yeon-Tae Yu, Cheul-Ro Lee, Byeong-Kwon Ju*, Youngmin Kim*, Jong-Woong Kim*, Transparent, Pressure-Sensitive, and Healable E-Skin from a UV-Cured Polymer Comprising Dynamic Urea Bonds, Journal of Materials Chemistry A, 7, 3101, 2019, corresponding author (IF: 12.732). (Selected as "2019 Journal of Materials Chemistry A HOT Papers")

2018

128. Kwang-Seok Kim, Sun Ok Kim, Chul Jong Han, Dae-Up Kim, Jin Soo Kim, Yeontae Yu, Cheul-Ro Lee*, and Jong-Woong Kim*, Revisiting the thickness reduction approach for near-foldable capacitive touch sensors based on a single layer of Ag nanowire-polymer composite structure, Composites Science and Technology, 165, 58, 2018, corresponding author (IF: 8.528).

127. Kwang-Seok Kim, Su Bin Choi, Dae-Up Kim, Cheul-Ro Lee*, and Jong-Woong Kim*, Photo-induced healing of stretchable transparent electrodes based on thermoplastic polyurethane with embedded metallic nanowires, Journal of Materials Chemistry A, 6, 12420, 2018, corresponding author (IF: 12.732).

126. Sang-Woo Kim, Kwang-Seok Kim, Meyongkoo Park, Wansoo Nah, Dae-Up Kim, Cheul-Ro Lee, Seung-Boo Jung*, and Jong-Woong Kim*, 1.4 µm-thick Transparent Radio Frequency Transmission Lines Based on Instant Fusion of Polyethylene Terephthalate Through Surface of Ag Nanowires, Electronic Materials Letters, 14, 599, 2018, corresponding author (IF: 3.017).

125. Sang-Woo Kim, Kwangho Kim, Wansoo Nah. Cheul-Ro Lee, Seung-Boo Jung*, and Jong-Woong Kim*, Transparent and flexible high frequency transmission lines based on composite structure comprising silver nanowires and polyvinyl butyral, Composites Science and Technology, 159, 25, 2018, corresponding author (IF: 8.528).

124. Sungwoo Jun, Youngmin Kin, Byeong-Kwon Ju, and Jong-Woong Kim*, Extremely flexible, transparent, and strain-sensitive electroluminescent device based on ZnS:Cu-polyvinyl butryral composite and silver nanowires, Applied Surface Science, 429, 144, 2018, corresponding author (IF: 6.707).

123. Byungwook Yoo, Youngmin Kim, Chul Jong Han, Min Suk Oh, and Jong-Woong Kim*, Recyclable patterning of silver nanowire percolated network for fabrication of flexible transparent electrode, Applied Surface Science, 429, 151, 2018, corresponding author (IF: 6.707).

122. Jong-Woong Kim, Da Hee Lee, Sung Il Jang, Hyun Min Cho, Youngmin Kim*, Recyclable thermosetting thermal pad using silicone-based polyurethane crosslinked by Diels-Alder adduct, Applied Surface Science, 429, 128, 2018, first author (IF: 6.707).

121. Dipal Patel, Malkeshkumar Patel, Khushbu Chauhan, Joondong Kim*, Min Suk Oh, and Jong-Woong Kim*, High-performing flexible and transparent photodetector by using silver nanowire-networks, Materials Research Bulletin, 97, 244, 2018, corresponding author (IF: 4.641.

2017

120. Chul Jong Han, Bum-Geun Park, Min Suk Oh, Seung-Boo Jung, and Jong-Woong Kim*, Photo-induced fabrication of Ag nanowire circuitry for invisible, ultrathin, conformable pressure sensors, Journal of Materials Chemistry C, 5, 9986, 2017, corresponding author (IF: 7.393).

119. Malkeshkumar Patel, Khushbu Chauhan, Joondong Kim*, Jong-Woong Kim, and Donggun Lim*, AgNWs networks for high-performing transparent heaters by using NiO window layer, Sensors and Actuators: A. Physical, 267, 8, 2017 (IF: 3.407).

118. Chan-Jae Lee, Keum Hwan Park, Chul Jong Han, Min Suk Oh, Banseok You, Young-Seok Kim, and Jong-Woong Kim*, Crack-induced Ag nanowire networks for transparent, stretchable, and highly sensitive strain sensors, Scientific Reports, 7, 7959, a sister journal of Nature, 2017, corresponding author (IF: 4.379).

117. Jong-Woong Kim and Jiwan Kim*, Flexible InP based quantum dot light-emitting diodes using Ag nanowire-colorless polyimide composite electrode, Journal of Vacuum Science & Technology B, 35, 04E101, 2017, first author (IF: 1.416).

116. Sungwoo Jun, Chul Jong Han, Youngmin Kim, Byeong-Kwon Ju, and Jong-Woong Kim*, Pressure-induced Bending Sensitive Capacitor Based on Elastomer-free Extremely Thin Transparent Conductor, Journal of Materials Chemistry A, 5, 3221, Selected as a front cover article, 2017, corresponding author (IF: 12.732).

115. Banseok You, Youngmin Kim, Byeong-Kwon Ju, and Jong-Woong Kim*, Highly Stretchable and Waterproof Electroluminescence Device Based on Superstable Stretchable Transparent Electrode, ACS Applied Materials & Interfaces, 9, 5486, 2017, corresponding author (IF: 9.229).

114. Youngmin Kim, Sungwoo Jun, Byeong-Kwon Ju, and Jong-Woong Kim*, Heterogeneous Configuration of a Ag Nanowire/Polymer Composite Structure for Selectively Stretchable Transparent Electrodes, ACS Applied Materials & Interfaces, 9, 7505, 2017, corresponding author (IF: 9.229).

113. Seung-Won Yeom, Banseok You, Karam Cho, Hyun Young Jung, Junsu Park, Changhwan Shin Byeong-Kwon Ju, and Jong-Woong Kim*, Silver Nanowire/Colorless-Polyimide Composite Electrode: Application in Flexible and Transparent Resistive Switching Memory, Scientific Reports, 7, 3438, a sister journal of Nature, 2017, corresponding author (IF: 4.379).

112. Sungwoo Jun, Byeong-Kwon Ju, and Jong-Woong Kim*, Fabrication of substrate-free double-side emitting flexible device based on silver nanowire-polymer composite electrode, Current Applied Physics, 17, 6, 2017, corresponding author (IF: 2.480).

111. Chan-Jae Lee, Sungwoo Jun, Byeong-Kwon Ju, Jong-Woong Kim*, Pressure-sensitive strain sensor based on a single percolated Ag nanowire layer embedded in colorless polyimide, Physica B, 514, 8, 2017, corresponding author (IF: 2.478).

2016

110. Kyoung-hee Pyo, and Jong-Woong Kim*, Thermally stable and flexible transparent heaters based on silver nanowire-colorless polyimide composite electrode, Current Applied Physics, 16, 1453, 2016, corresponding author (IF: 2.480).

109. Banseok You, Byeong-Kwon Ju, and Jong-Woong Kim*, Photoresist-assisted fabrication of thermally and mechanically stablesilver nanowire-based transparent heaters, Sensors and Actuators A: Physical, 250, 123, 2016, corresponding author (IF: 3.407).

108. Kyoung-hee Pho, and Jong-Woong Kim*, Transparent and mechanically robust flexible heater based on compositing of Ag nanowires and conductive polymer, Composites Science and Technology, 133, 7, 2016, corresponding author (IF: 8.528). (Featured in 전자신문)

107. Sungwoo Jun, Byeong-Kwon Ju, and Jong-Woong Kim*, Ultra-Facile Fabrication of Stretchable and Transparent Capacitive Sensor Employing Photo-Assisted Patterning of Silver Nanowire Networks, Advanced Materials Technologies, 1, 1600062, Selected as a front cover article, 2016, corresponding author (IF: 7.848).

106. Banseok You, Chul Jong Han, Youngmin Kim, Byeong-Kwon Ju, and Jong-Woong Kim*, Wearable piezocapacitive pressure sensor with a single layer of silver nanowire-based elastomeric composite electrode, Journal of Materials Chemistry A, 4, 10435, Selected as an outside back cover article, 2016, corresponding author (IF: 12.732).

105. Gaeun Heo, Kyoung-hee Pyo, Da Hee Lee, Youngmin Kim*, and Jong-Woong Kim*, Critical Role of Diels–Adler Adducts to Realise Stretchable Transparent Electrodes Based on Silver Nanowires and Silicone Elastomer, Scientific Reports, 6, 25358, a sister journal of Nature, 2016, corresponding author (IF: 4.379).

104. Dae-Gon Kim, Jiwan Kim, Seung-Boo Jung, Young-Sung Kim∗, Jong-Woong Kim*, Electrically and mechanically enhanced Ag nanowires-colorless polyimide composite electrode for flexible capacitive sensor, Applied Surface Science, 380, 223, 2016, corresponding author (IF: 6.707).

103. Nguyen Van Nghia, Jong-Woong Kim, Youngmin Kim*, and Min-Hyung Lee*, Triarylboryl-Functionalized Oxadiazole as a host material with electron transporting property for green PhOLEDs, Bulletin of the Korean Chemical Society, 37, 864, 2016 (IF: 0.969).

102. Chang-Hyun Song, Chul Jong Han, Byeong-Kwon Ju*, and Jong-Woong Kim*, Photo-enhanced patterning of metal nanowire networks for fabrication of ultra-flexible transparent devices, ACS Applied Materials & Interfaces, 8, 480, 2016, corresponding author (IF: 9.229).

101. Da Hee Lee, Gaeun Heo, Kyoung-hee Pyo, Youngmin Kim*, and Jong-Woong Kim*, Mechanically Robust and Healable Transparent Electrode Fabricated via Vapor-Assisted Solution Process, ACS Applied Materials & Interfaces, 8, 8129, 2016, corresponding author (IF: 9.229).

100. Youngmin Kim, and Jong-Woong Kim*, Silver nanowire networks embedded in urethane acrylate for flexiblecapacitive touch sensor, Applied Surface Science, 363, 1, 2016, corresponding author (IF: 6.707).

99. Kyoung-hee Pyo, Da Hee Lee, Youngmin Kim*, and Jong-Woong Kim*, Extremely rapid and simple healing of a transparent conductor based on Ag nanowires and polyurethane with a Diels–Alder network, Journal of Materials Chemistry C, 4, 972, 2016, corresponding author (IF: 7.393).

98. Chang-Hyun Song, Youngmin Kim, Byeong-Kwon Ju*, and Jong-Woong Kim*, Preparation of core–shell microstructures using an electroless plating method, Materials and Design, 89, 1278, 2016, corresponding author (IF: 7.991).

97. Dong-Hwan Kim, Youngmin Kim, and Jong-Woong Kim*, Transparent and flexible film for shielding electromagnetic interference, Materials and Design, 89, 703, 2016, corresponding author (IF: 7.991).

2015

96. Dong-Hwan Kim, Ki-Cheol Yu, Youngmin Kim*, and Jong-Woong Kim*, Highly Stretchable and Mechanically Stable Transparent Electrode Based on Composite of Silver Nanowires and Polyurethane−Urea, ACS Applied Materials & Interfaces, 7, 15214, 2015, corresponding author (IF: 9.229).

95. Kwang-Seok Kim, Bum-Geun Park, Kwang-Ho Jung, Seung-Boo Jung*, and Jong-Woong Kim*, The critical role of Ag nanowires in the improvement of conductivity and flexibility of circuits fabricated with hybrid Ag nanopaste, Journal of Materials Science: Materials in Electronics, 26, 8644, 2015, corresponding author (IF: 2.478).

94. Kwang-Seok Kim, Bum-Geun Park, Kwang-Ho Jung, Jong-Woong Kim, Myung Yung Jeong, and Seung-Boo Jung*, Microwave Sintering of Silver Nanoink for Radio Frequency Applications, Journal of Nanoscience and Nanotechnology, 15, 2333, 2015 (IF: 1.134).

93. Youngmin Kim, Tae In Ryu, Ki-Hoon Ok, Min-Gi Kwak, Sungmin Park, Nam-Gyu Park, Chul Jong Han, Bong Soo Kim, Min Jae Ko, Hae Jung Son*, and Jong-Woong Kim*, Inverted Layer-By-Layer Fabrication of an Ultraflexible and Transparent Ag Nanowire/Conductive Polymer Composite Electrode for Use in High-Performance Organic Solar Cells, Advanced Functional Materials, 25, 4580, Selected as a cover article, 2015, corresponding author (IF: 18.808). (Featured in 전자신문, 매일경제, 서울경제, 디지털타임즈, 경기신문 외 다수)

92. Ki-Hun Ok, Jiwan Kim, So-Ra Park, Youngmin Kim, Chan-Jae Lee, Sung-Jei Hong, Min-Gi Kwak, Namsu Kim, Chul Jong Han*, and Jong-Woong Kim*, Ultra-thin and smooth transparent electrode for flexible and leakage-free organic light-emitting diodes, Scientific Reports, 5, 9464, a sister journal of Nature, 2015, corresponding author (IF: 4.379). (Featured in YTN, 아리랑 TV, 전자신문, 매일경제, 서울경제, 디지털타임즈 외 다수)

91. Youngmin Kim, Da Hee Lee, Dong-Hwan Kim, and Jong-Woong Kim*, Flexible and transparent electrode based on silver nanowires and a urethane acrylate incorporating Diels–Alder adducts, Materials and Design, 88, 1158, 2015, corresponding author (IF: 7.991).

90. Chang-Hyun Song, Ki-Hoon Ok, Chan-Jae Lee, Youngmin Kim, Min-Gi Kwak, Chul Jong Han, Namsu Kim, Byeong-Kwon Ju*, and Jong-Woong Kim*, Intense-pulsed-light irradiation of Ag nanowire-based transparent electrodes for use in flexible organic light emitting diodes, Organic Electronics, 17, 208, 2015, corresponding author (IF: 3.721).

89. Youngmin Kim, Chang-Hyun Song, Min-Gi Kwak, Byeong-Kwon Ju*, and Jong-Woong Kim*, Flexible touch sensor with finely patterned Ag nanowires buried at the surface of a colorless polyimide film, RSC Advances, 5, 42500, 2015, corresponding author (IF: 3.361).

2014

88. Sung-Jei Hong∗, Jong-Woong Kim, and Yong-Hoon Kim*, Solution-Processed Silver Nanowire/Indium-Tin-Oxide Nanoparticle Hybrid Transparent Conductors with High Thermal Stability, Journal of Nanoscience and Nanotechnology, 14, 9504, 2014 (IF: 1.338).

87. Ki-Hun Ok, Chan-Jae Lee, Min-Gi Kwak, Duck-Kyun Choi, Kwang-Seok Kim, Seung-Boo Jung, and Jong-Woong Kim*, Effect of Ag Nanowire Addition Into Nanoparticle Paste on the Conductivity of Ag Patterns Printed by Gravure Offset Method, Journal of Nanoscience and Nanotechnology, 14, 8808, 2014, corresponding author (IF: 1.338).

86. Yong-Hoon Kim, Tae-Hyoung Kim, Yeji Lee, Jong-Woong Kim, Jaekyun Kim, and Sung Kyu Park∗, Contact-Enhanced Transparent Silver Nanowire Network for All Solution-Based Top-Contact Metal-Oxide Thin-Film Transistors, Journal of Nanoscience and Nanotechnology, 14, 8158, 2014 (IF: 1.338).

2013

85. Jong-Woong Kim, Hoo-Jeong Lee, and Seung-Boo Jung*, Effect of surface treatment on the high-speed drop reliability of Pb-free solder interconnect, Thin Solid Films, 547, 120, 2013, first author (IF: 1.761).

84. Jong-Woong Kim*, Sung-Won Lee, Yeji Lee, Seung-Boo Jung, Sung-Jei Hong, and Min-Gi Kwak, Synthesis of Ag Nanowires for the Fabrication of Transparent Conductive Electrode, Journal of Nanoscience and Nanotechnology, 13, 6244, 2013, first & corresponding author (IF: 1.338).

83. Jong-Woong Kim∗, Jang-Woo Choi, Sung-Jei Hong, and Min-Gi Kwak, Microwave Annealing of Indium Tin Oxide Nanoparticle Ink Patterned by Ink-Jet Printing, Journal of Nanoscience and Nanotechnology, 13, 6005, 2013, first & corresponding author (IF: 1.338).

82. Jong-Woong Kim∗, Jae-Shik Shim, Changjun Maeng, Young-Sung Kim, Jinho Ahn, Min-Gi Kwak, Sung-Jei Hong, and Hyun-Min Cho, Fabrication of SiC Nanoparticles by Physical Milling for Ink-Jet Printing, Journal of Nanoscience and Nanotechnology, 13, 5586, 2013, first & corresponding author (IF: 1.338).

81. Jong-Woong Kim∗, Jae-Shik Shim, Min-Gi Kwak, Sung-Jei Hong, and Hyun-Min Cho, Application of Rapid Milling Technology for Fabrication of SiC Nanoparticles, Journal of Nanoscience and Nanotechnology, 13, 6064, 2013, first & corresponding author (IF: 1.338).

80. Young-Chul Lee, Jong-Woong Kim, Yongil Kim, Seung-Boo Jung*, Reliability of chip on glass module fabricated with direct printing method, Microelectronic Engineering, 107, 114, 2013 (IF: 1.277).

79. Young-Chul Lee, Jong-Woong Kim, Jeong-Won Yoon, Cheol-Woong Yang, Yongil Kim, and Seung-Boo Jung*, Effects of Atmospheric Pressure Plasma Surface Treatments on the Patternability and Electrical Property of Screen-Printed Ag Nanopaste, Metals and Materials International, 19, 829, 2013 (IF: 1.815).

78. Sung-Jei Hong∗, Jong-Woong Kim, and Seung-Boo Jung, Characterization of Reliability of Printed Indium Tin Oxide Thin Films, Journal of Nanoscience and Nanotechnology, 13, 7770, 2013 (IF: 1.338).

2012

77. Jong-Woong Kim, and Seung-Boo Jung, Ductile Fracture Mechanism of Low-Temperature In–48Sn Alloy Joint Under High Strain Rate Loading, Journal of Nanoscience and Nanotechnology, 12, 3259, 2012, first author (IF: 1.338).

76. Seong-jae Jeon, Jong-Woong Kim, Byunghoon Lee, Hak-Joo Lee, Seung-Boo Jung, Seungmin Hyun, Hoo-Jeong Lee*, Evaluation of drop reliability of Sn–37Pb solder/Cu joints using a high speed lap-shear test, Microelectronic Engineering, 91, 147, 2012 (IF: 1.277).

75. Sung-Jei Hong*, Min-Sun Kim, Jong-Woong Kim, and Myeongsuk Shin, Characteristics of IndiumTinOxide (ITO) Glass Re-Used from Old TFT-LCD Panel, Materials Transactions, 53, 968, 2012 (IF: 0.689).

74. Sung-Jei Hong∗, Jong-Woong Kim and Sung-Won Lee, Young Sung Kim, Nam-Kee Kang, Enhancement of Synthetic Speed of Ag Nanoparticle for Electrodes of Solar Cells by Using Microwave Radiation, Journal of the Korean Physical Society, 60, 2067, 2012 (IF: 0.445).

73. Byunghoon Lee, Haseok Jeon, Soonjae Kim, Kee-won Kwon, Jong-Woong Kim, and Hoo-jeong Lee*, Introduction of an Electroless-Plated Ni Diffusion Barrier in Cu/Sn/Cu Bonding Structures for 3D Integration, Journal of The Electrochemical Society, 159, H85, 2012 (IF: 3.014).

2011

72. Kwang-Seok Kim, Young-Chul Lee, Jong-Woong Kim, and Seung-Boo Jung∗, Flexibility of Silver Conductive Circuits Screen-Printed on a Polyimide Substrate, Journal of Nanoscience and Nanotechnology, 11, 1493, 2011 (IF: 1.338).

71. Young-Chul Lee, Kwang-Seok Kim, Jong-Woong Kim, Jong-Min Kim, Wansoo Nah, Seong-Hee Lee, and Seung-Boo Jung∗, Electrical Characteristics of Printed Ag Nanopaste on Polyimide Substrate, Journal of Nanoscience and Nanotechnology, 11, 1468, 2011 (IF: 1.338).

70. Sang-Su Ha, Jong-Woong Kim, Sang-Ok Ha and Seung-Boo Jung*, Shear test parameters for brittle fracture of flip chip solder joint, Materials Science and Technology, 27, 696, 2011 (IF: 1.18).

69. Jong-Woong Kim*, Sung-Jei Hong, and Min-Gi Kwak, Characteristics of eco-friendly synthesized SiO2 dielectric nanoparticles printed on Si substrate, Microelectronic Engineering, 88, 797, 2011, first & corresponding author (IF: 1.277).

68. Jong-Woong Kim, Byung-Kwon Jeon, Sung-Won Lee, Sung-Jei Hong, Young-Seok Kim, Min-Gi Kwak, Nam Kee Kang, Young-Chul Lee, and Seung-Boo Jung, Effect of heat treatment on physical and electrical characteristics of conductive circuits printed on Si substrate, Microelectronic Engineering, 88, 791, 2011, first author (IF: 1.277).

67. Sung-Jei Hong, Jong-Woong Kim, Jeong In Han, Improvement of electrical properties of printed ITO thin films by heat-treatment conditions, Current Applied Physics, 11, S202, 2011 (IF: 2.144).

66. Jong-Woong Kim, Young-Chul Lee, Kwang-Seok Kim, Seung-Boo Jung, High frequency characteristics of printed Cu conductive circuit, Journal of Nanoscience and Nanotechnology, 11, 537, 2011, first author (IF: 1.338).

65. Min-Kyu Kang, Jong-Woong Kim, Min-Gi Kwak, Ho-Gyu Yoon, and Young-Seok Kim∗, Synthesis of Cu Nanoparticles with Self-Assembled Monolayers via Inert-Gas Condensation, Journal of Nanoscience and Nanotechnology, 11, 6020, 2011 (IF: 1.338).

64. Young-Chul Lee, Jee-Hyuk Ahn, Kwang-Seok Kim, Jeong-Won Yoon, Jong-Woong Kim, Yongil Kim, and Seung-Boo Jung∗, Effect of Sintering Temperature on Electrical Characteristics of Screen-Printed Ag Nanopaste on FR4 Substrate, Journal of Nanoscience and Nanotechnology, 11, 5915, 2011 (IF: 1.338).

2010

63. Jong-Woong Kim*, Young-Seok Kim, Sung-Jei Hong, Tae-Hwan Hong and Jeong-In Han, Physical and electrical properties of SiO2 layer synthesized by eco-friendly method, Japanese Journal of Applied Physics, 49, 05EA02, 2010, first & corresponding author (IF: 1.122).

62. Jong-Woong Kim and Seung-Boo Jung, Failure mechanism of Pb-bearing and Pb-free solder joints under high-speed shear loading, Metals and Materials International, 16, 7, 2010, first author (IF: 1.815).

61. Sung-Jei Hong, Jong-Woong Kim, Jae-Won Lim, Good-Sun Choi and Minoru Isshiki, Characteristics of printed thin films using indium tin oxide (ITO) ink, Materials Transactions, 51, 1905, 2010 (IF: 0.689).

60. Jong-Woong Kim*, Jangwoo Choi, Sung-Jei Hong, Jeong-In Han, Young-Sung Kim, Effects of the concentration of indoim-tin-oxide (ITO) ink on the characteristics of directly-printed ITO thin films, Journal of the Korean Physical Society, 57, 1794, 2010, first & corresponding author (IF: 0.445).

59. Jong-Woong Kim, Young-Chul Lee, Jong-Min Kim, Wansoo Nah, Hyo-Soo Lee, Hyuk-Chon Kwon and Seung-Boo Jung, Characterization of direct patterned Ag circuits for RF application, Microelectronic Engineering, 87, 379, 2010, first author (IF: 1.277).

2009

58. Sang-Su Ha, Sang-Ok Ha, Jin-Kyu Jang, Jeong-Won Yoon, Jong-Woong Kim, Min-Kwan Ko, Dae-Gon Kim, Myung-Wan Ko and Seung-Boo Jung, Solder joint reliability in flip chip package with surface treatment of ENIG under thermal shock test, Metals and Materials International, 15, 655, 2009 (IF: 1.815).

57. Bo-In Noh, Jeong-Won Yoon, Jong-Woong Kim, Jong-Bum Lee, Noh-Chang Park, Won-Sik Hong, Seung-Boo Jung, Reliability of Au bump flip chip packages with adhesive materials using four-point bending test, International Journal of Adhesion and Adhesives, 29, 650, 2009 (IF: 1.956).

56. Sang-Su Ha, Sang-Ok Ha, Jin-Kyu Jang, Jong-Woong Kim, Jong-Bum Lee and Seung-Boo Jung, Failure behaviors of flip chip solder joints under various loading conditions of high-speed shear test, International Journal of Modern Physics B, 23, 1809, 2009 (IF: 0.850).

55. Sang-Su Ha, Jin-Kyu Jang, Sang-Ok Ha, Jong-Woong Kim, Jeong-Won Yoon, Byung-Woo Kim, Sung-Kyu Park and Seung-Boo Jung, Mechanical property evaluation of Sn-3.0Ag-0.5Cu BGA solder joints using high-speed ball shear test, Journal of Electronic Materials, 38, 2489, 2009 (IF: 1.491).

54. Jong-Woong Kim and Seung-Boo Jung, Electrical Characterization of Screen-Printed Conductive Circuit with Silver Nanopaste, Japanese Journal of Applied Physics, 48, 06FD14, 2009, first author (IF: 1.122).

53. Jong-Bum Lee, Ja-Myeong Koo, Jong-Woong Kim, Bo-In Noh, Jong-Gun Lee and Seung-Boo Jung, Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF), Journal of Adhesion, 85, 341, 2009 (IF: 1.409).

52. Jong-Woong Kim and Seung-Boo Jung, Fabrication and electrical characterization of Through-Si-Via interconnect for 3D packaging, Journal of Micro/Nanolithography, MEMS, MOEMS, 8, 013040, 2009, first author (IF: 1.335).

51. Jong-Woong Kim, Wansoo Nah and Seung-Boo Jung, Transmission property of flip chip package with adhesive interconnection for RF applications, Microelectronic Engineering, 86, 314, 2009, first author (IF: 1.277).

50. Jong-Wooong Kim, Young-Chul Lee, Sang-Su Ha and Seung-Boo Jung, Failure behaviors of BGA solder joints under various loading conditions of high-speed shear test, Journal of Materials Science: Materials in Electronics, 20, 17, 2009, first author (IF: 1.798).

49. Sang-Su Ha, Jong-Woong Kim, Jeong-Won Yoon and Seung-Boo Jung, Electromigration behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu flip chip solder joints under high current density, Journal of Electronic Materials, 38, 70, 2009 (IF: 1.491).

2008

48. Bo-In Noh, Jong-Bum Lee, Jong-Woong Kim and Seung-Boo Jung, Evaluation of thermal and hygro-thermal behavior on flip chip package with non-conductive paste, Journal of Adhesion Science & Technology, 22, 1355, 2008 (IF: 0.863).

47. Jong-Woong Kim, Jin-Kyu Jang, Sang-Ok Ha, Sang-Su Ha, Dae-Gon Kim and Seung-Boo Jung, Effect of high-speed loading conditions on the fracture mode of the BGA solder joint, Microelectronics Reliability, 48, 1882, 2008, first author (IF: 1.202).

46. Jong-Woong Kim, Young-Chul Lee, Wansoo Nah and Seung-Boo Jung, Microwave performance of flip chip interconnects with anisotropic and non-conductive films, Journal of Adhesion Science & Technology, 22, 1339, 2008, first author (IF: 0.863).

45. Jeong-Won Yoon, Hyun-Suk Chun, Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Hoo-Jeong Lee and Seung-Boo Jung, Mechanical reliability of Sn-rich Au–Sn/Ni flip chip solder joints fabricated by sequential electroplating method, Microelectronics Reliability, 48, 1857, 2008 (IF: 1.202).

44. Seong-jae Jeon, Seungmin Hyun, Hak-Joo Lee, Jong-Woong Kim, Sang-Su Ha, Jeong-Won Yoon, Seung-Boo Jung and Hoo-Jeong Lee, Mechanical reliability evaluation of Sn-37Pb solder joint using high speed lap-shear test, Microelectronic Engineering, 85, 1967, 2008 (IF: 1.277).

43. Jeong-Won Yoon, Ja-Myeong Koo, Jong-Woong Kim, Sang-Su Ha, Bo-In Noh, Chang-Yong Lee, Jong-Hyun Park, Chang-Chae Shur and Seung-Boo Jung, Effect of boron content in electroless Ni-B layer on plating layer properties and soldering characteristics with Sn-Ag solder, Journal of Alloys and Compounds, 466, 73, 2008 (IF: 3.014).

42. Jong-Woong Kim, Ja-Myeong Koo, Chang-Yong Lee, Bo-In Noh, Jeong-Won Yoon, Dae-Gon Kim, Sun-Kyu Park and Seung-Boo Jung, Thermal degradation of anisotropic conductive film joints under temperature fluctuation, International Journal of Adhesion and Adhesives, 28, 314, 2008, first author (IF: 1.956).

41. Ja-Myeong Koo, Yu-Na Kim, Jeong-Won Yoon, Dae-Gon Kim, Bo-In Noh, Jong-Woong Kim, Jung-Hoon Moon and Seung-Boo Jung, Effect of displacement rate on bump shear properties of electriplated solder bumps in flip-chip packages, Materials Science & Engineering A, 483-484, 620, 2008 (IF: 2.647).

40. Dae-Gon Kim, Jong-Woong Kim, Sang-Su Ha, Bo-In Noh, Ja-Myeong Koo, Dong-Woon Park, Myung-Wan Ko and Seung-Boo Jung, Effect of reflow numbers on the interfacial reaction and shear strength of flip chip solder joints, Journal of Alloys and Compounds, 458, 253, 2008 (IF: 3.014).

39. Jong-Woong Kim, Young-Chul Lee and Seung-Boo Jung, Effect of bonding conditions on conduction behavior of anisotropic conductive film, Metal and Materials International, 14, 373, 2008, first author (IF: 1.815).

38. Chang-Yong Lee, Won-Bae Lee, Jong-Woong Kim, Don-Hyun Choi, Yun-Mo Yeon and Seung-Boo Jung, Lap joint properties of FSWed dissimilar formed 5052 Al and 6061 Al alloys with different thickness, Journal of Materials Science, 43, 3296, 2008 (IF: 2.302).

37. Ja-Myeong Koo, Jung-Lae Jo, Jong-Bum Lee, Yu-Na Kim, Jong-Woong Kim, Bo-In Noh, Jeong-Hoon Moon, Dae-Up Kim and Seung-Boo Jung, Effect of atmospheric pressure plasma treatment on transverse ultrasonic bonding of gold flip-chip bump on glass substrate, Japanese Journal of Applied Physics, 47, 4309, 2008 (IF: 1.122).

36. Jong-Woong Kim, Young-Chul Lee, Sang-Su Ha, Ja-Myeong Koo, Jae-Hoon Ko, Wansoo Nah and Seung-Boo Jung, Electrical characterization of adhesive flip chip interconnects for microwave application, Journal of Micro/Nanolithography, MEMS, MOEMS, 7, 23007, 2008, first author (IF: 1.335).

35. Jong-Woong Kim, Dae-Gon Kim, Young-Chul Lee and Seung-Boo Jung, Analysis of failure mechanism in anisotropic conductive and non-conductive film interconnections, IEEE Transactions on Components and Packaging Technologies, 31, 65, 2008, first author (IF: 1.151).

34. Ja-Myeong Koo, Bui Quoc Vu, Yu-Na Kim, Jong-Bum Lee, Jong-Woong Kim, Dae-Up Kim, Jeong-Hoon Moon and Seung-Boo Jung, Mechanical and electrical properties of Cu/Sn-3.5Ag/Cu ball grid array (BGA) solder joints after multiple reflows, Journal of Electronic Materials, 37, 118, 2008 (IF: 1.491).

33. Jong-Woong Kim, Young-Chul Lee and Seung-Boo Jung, Reliability of conductive adhesives as a Pb-free alternative in flip chip applications, Journal of Electronic Materials, 37, 9, 2008, first author (IF: 1.491).

2007

32. Sang-Su Ha, Dae-Gon Kim, Jong-Woong Kim, Jeong-Won Yoon, Jin-Ho Joo, Young-Eui Shin and Seung-Boo Jung, Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method, Microelectronic Engineering, 84, 2640, 2007 (IF: 1.277).

31. Jong-Woong Kim, Young-Chul Lee, Dae-Gon Kim and Seung-Boo Jung, Reliability of adhesive interconnections for application in display module, Microelectronic Engineering, 84, 2691, 2007, first author (IF: 1.277).

30. Jong-Woong Kim and Seung-Boo Jung, Design of solder joint structure for flip chip package with an optimized shear test method, Journal of Electronic Materials, 36, 690, 2007, first author (IF: 1.491).

29. Jong-Woong Kim and Seung-Boo Jung, Thermal and hygroscopic reliability of flip chip packages with an anisotropic conductive film, Journal of Adhesion Science & Technology, 21, 1071, 2007, first author (IF: 0.863).

28. Jong-Woong Kim and Seung-Boo Jung, Behavior of anisotropic conductive film joints bonded in various forces under temperature fluctuation, Journal of Electronic Materials, 36, 1199, 2007, first author (1.491).

27. Dae-Gon Kim, Jong-Woong Kim, Sang-Su Ha, Ja-Myeong Koo, Bo-In Noh and Seung-Boo Jung, Reliability evaluation of underfill encapsulated Pb- free flip chip package under thermal shock test, Materials Science Forum, 544-545, 621, 2007 (IF: 0.399).

26. Jong-Woong Kim, Ja-Myeong Koo, Jeong-Won Yoon, Sunglak Choi, Kyung-Sik Kim, Jae-Do Nam and Seung-Boo Jung, Characterization of failure behaviors in anisotropic conductive interconnection, Materials Transactions, 48, 1070, 2007, first author (IF: 0.689).

25. Jong-Woong Kim and Seung-Boo Jung, Effect of bonding force on the reliability of the flip chip packages employing anisotropic conductive film with reflow process, Materials Science & Engineering A, 452-453, 267, 2007, first author (IF: 2.647).

2006

24. Jong-Woong Kim, Won-Chul Moon and Seung-Boo Jung, Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection, Microelectronic Engineering, 83, 2335, 2006, first author (IF: 1.277).

23. Bo-In Noh, Ja-Myeong Koo, Jong-Woong Kim, Dae-Gon Kim, Jae-Do Nam, Jinho Joo and Seung-Boo Jung, Effects of number of reflows on the mechanical and electrical properties of BGA package, Intermetallics, 14, 1375, 2006 (IF: 2.541).

22. Dae-Gon Kim, Jong-Woong Kim, Jeong-Won Yoon, Won-Bae Lee, Seung-Boo Jung, Characteristic analysis of electroless Ni plating layer for electronic packaging, Surface and Interface Analysis, 38, 440, 2006 (IF: 1.018).

21. Dae-Gon Kim, Jong-Woong Kim and Seung-Boo Jung, Evaluation of solder joint reliability in flip chip package under thermal shock test, Thin Solid Films, 504, 426, 2006 (IF: 1.761).

20. Jong-Woong Kim, Dae-Gon Kim and Seung-Boo Jung, Investigations of the test parameters and bump structures in the shear test of flip chip solder bump, Thin Solid Films, 504, 405, 2006, first author (IF: 1.761).

19. Jong-Woong Kim and Seung-Boo Jung, Reexamination of the solder ball shear test for evaluation of the mechanical joint strength, International Journal of Solids and Structures, 43, 1928, 2006, first author (IF: 2.081).

18. Jong-Woong Kim and Seung-Boo Jung, Effects of void formation within the Pb-free BGA solder balls on the mechanical joint strength, Materials Science Forum, 510-511, 546, 2006, first author (IF: 0.399).

17. Jong-Woong Kim, Dae-Gon Kim and Seung-Boo Jung, Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application, Microelectronics Reliability, 46, 535, 2006, first author (IF: 1.202).

16. Jong-Woong Kim, Hyun-Suk Chun, Sang-Su Ha, Jong-Hyuck Chae, Jinho Joo, Young-Eui Shin and Seung-Boo Jung, Board-level reliability of Pb-free surface mounted assemblies during thermal shock testing, Advanced Materials Research, 15-17, 633, 2006, first author (IF: 0.333).

2005

15. Jong-Woong Kim and Seung-Boo Jung, Optimization of shear test for flip chip solder bump using 3-dimensional computer simulation, Microelectronic Engineering, 82, 554, 2005, first author (IF: 1.277).

14. Jong-Woong Kim, Sun-Kyu Park and Seung-Boo Jung, Analysis of the test parameters in the shear test of BGA solder joints, Key Engineering Materials, 297-300, 851, 2005, first author (IF: 0.224).

13. Dae-Gon Kim, Hyung-Sun Jang, Jong-Woong Kim and Seung-Boo Jung, Investigations of interfacial reaction and shear strength between Pb-free flip chip solder and electroplated Cu UBM, Key Engineering Materials, 297-300, 863, 2005 (IF: 0.224).

12. Jong-Woong Kim, Dae-Gon Kim, Won Sik Hong and Seung-Boo Jung, Evaluation of solder joint reliability in flip chip packages during accelerated testing, Journal of Electronic Materials, 34, 1550, 2005, first author (IF: 1.491).

11. Dae-Gon Kim, Jong-Woong Kim and Seung-Boo Jung, Reliability evaluations of flip chip package under thermal shock test, Microelectronic Engineering, 82, 554, 2005 (IF: 1.277).

10. Dae-Gon Kim, Jong-Woong Kim and Seung-Boo Jung, Effect of aging conditions on interfacial reaction and mechanical joint strength between Sn-3.0Ag-0.5Cu solder and Ni-P UBM, Materials Science & Engineering B, 121, 204, 2005 (IF: 2.331).

9. Dae-Gon Kim, Hyung-Sun Jang, Jong-Woong Kim and Seung-Boo Jung, Correlation between the interfacial reaction and mechanical joint strength of the flip chip solder bump during isothermal aging, Journal of Materials Science: Materials in Electronics, 16, 603, 2005 (IF: 1.798).

8. Jong-Woong Kim, Sun-Kyu Park and Seung-Boo Jung, Optimum shear height for evaluation of Pb-free solder ball shear strength, Materials Science Forum, 486-487, 269, 2005, first author (IF: 0.399).

7. Dae-Gon Kim, Jong-Woong Kim, Jung-Gu Lee, Hirotaro Mori, David J. Quesnel and Seung-Boo Jung, Solid state interfacial reaction and joint strength of Sn-37Pb solder with Ni-P under bump metallization in flip chip application, Journal of Alloys and Compounds, 395, 80, 2005 (IF: 3.014).

6. Jong-Woong Kim and Seung-Boo Jung, Characterization of the shear test method with low melting point In-48Sn solder joints, Materials Science & Engineering A, 397, 145, 2005, first author (IF: 2.647).

5. Jong-Woong Kim, Jinho Joo, David J. Quesnel and Seung-Boo Jung, Correlation between the displacement rate and shear force in the shear test of Sn-Pb and Pb-free solder joints, Materials Science and Technology, 21, 373, 2005, first author (IF: 1.18).

4. Jong-Woong Kim, Dae-Gon Kim and Seung-Boo Jung, Mechanical strength test method for solder ball joint in BGA package, Metal and Materials International, 11, 121, 2005, first author (IF: 1.815).

2004

3. Jong-Woong Kim, Jeong-Won Yoon and Seung-Boo Jung, Influence of shear speed on the shear force of eutectic Sn-Pb and Pb-free BGA solder joints, Materials Science Forum, 449-452, 897, 2004, first author (IF: 0.399).

2. Jong-Woong Kim and Seung-Boo Jung, Experimental and finite element analysis of the shear speed effects on the Sn-Ag and Sn-Ag-Cu BGA solder joints, Materials Science & Engineering A, 371, 267, 2004, first author (IF: 2.647).

2003

1. Won-Bae Lee, Jong-Woong Kim, Yun-Mo Yeon and Seung-Boo Jung, The joint characteristics of friction stir welded AZ91D magnesium alloy, Materials Transactions, 44, 917, 2003 (IF: 0.689).