Thank you for visiting Soft Devices & Packaging Laboratory in Sungkyunkwan University!
FMDL in SKKU is originated from FEDL in JBNU.
Our research area includes
Advanced semiconductor packaging materials and fabrication processes
Design and fabrication of smart materials for advanced soft electronics & biomedical devices
Artificial intelligence (Deep learning & machine learning)-integrated smart multifunctional devices
Skin-like ultrathin and stretchable transparent mechanical, chemical & optical sensors
Self-healable & stretchable materials and devices
Those considering graduate studies, current postdoctoral researchers, and prospective research professors with an interest in the development of soft devices and advanced packaging technologies are invited to reach out to Prof. Jong-Woong Kim.
(firstname.lastname@example.org, Room 23342, 1st Engineering Complex, Sungkyunkwan University)